Samsung’s Exynos 2500 is officially confirmed to power the Galaxy  Z  Flip 7 (model S5E9955), marking a historic debut of an Exynos chip in the Galaxy Z‑series and reinforcing Samsung’s global strategy .
🔧 Architecture & Fabrication
• Process node: 3 nm (second-gen Samsung Foundry) 
• CPU (10‑core):
• 1× Cortex‑X5 (X925) @ 3.3 GHz
• 2× Cortex‑A725 @ 2.75 GHz
• 5× Cortex‑A725 @ 2.36 GHz
• 2× Cortex‑A520 @ 1.8 GHz  
• Cache: 16 MB L3 (leaked) 
🎮 GPU & Graphics
• GPU: Xclipse 950 based on AMD’s RDNA 3.5 architecture, with 16 compute units—boosting ray‑tracing and graphical performance .
🧠AI & Connectivity
• AI acceleration: 24K‑MAC NPU (combining 2‑GNPU + 2‑SNPU) + integrated DSP
• Modem/satellite support: Includes Exynos 5400 modem and certified satellite messaging via Skylo’s NTN standard .
đź’ľ Memory & Storage
• RAM: LPDDR5X (likely running at 9600 MHz) 
• Storage: UFS 4.0/4.1
🖥️ Display & Multimedia
• Display support: Up to 4K and WQUXGA at 120 Hz
• Camera ISP: Handles up to 320 MP single, 108 MP @30 fps, and dual 64 MP + 32 MP setups
• Video: 8K @30 fps encoding and 8K @60 fps decoding; supports H.264, H.265, AV1   
đź“Š Benchmarks & Performance
• Geekbench 6 (Z Flip 7):
• Single‑core: 2,012
• Multi‑core: 7,563 
• Why scores seem modest: Samsung likely limits peak clocks (3.3 GHz) to manage thermals in compact foldable bodies .
🔍 Summary
• First-time deployment of Exynos in a Galaxy Z-series foldable—available globally 
• Notable features: Leading-edge 3 nm chip, AMD‑powered graphics, satellite messaging support
• Performance strategy: Prioritizes thermal stability and efficiency over raw benchmark dominance
🔥 Discussion Points:
• Can the RDNA 3.5 GPU close the gap with Snapdragon’s Adreno offerings?
• How critical is satellite connectivity for foldable users?
• Will thermal-first optimizations impact everyday performance?
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âś… TL;DR
Samsung’s Exynos 2500 brings a powerful, efficient and feature-rich chip built on 3 nm tech to the Galaxy Z Flip 7 worldwide—featuring advanced GPU, AI engine, and satellite support, balanced with smart thermal management suited for foldables.
